Market Overview
The 3D Integrated Circuit Market is expected to grow
significantly at a CAGR of 17% and is estimated to reach up to USD 10,470
Million during the forecast period.
The trend for 3D
Integrated Circuit Market is being
fueled by advancements in the microelectronics and semiconductor industries. It
aids in the enhancement of performance and functionality. It also aids in
reducing power usage following the requirements of electronic gadgets. Gadgets
such as tablets, smartphones, computers, and other electronic devices use 3D
integrated circuits. This extends the battery's life and saves a lot of space.
Cores, sensors, analog RF circuits, and other components make up each IC stack.
The coronavirus outbreak has a negative influence on the
market for 3D integrated circuits. The highly contagious sickness wreaked havoc
all around the globe. Due to the virus's rapid spread, millions of people died
all across the world in a short period. Several governments around the world
have imposed a state of emergency to stem the spread. This measure has a
significant impact on businesses and manufacturing units. During this time,
they suffered significant financial losses. It also resulted in a labor
shortage and a disruption in the supply chain. However, as people's knowledge
grows and healthcare infrastructure improves, the 3D IC industry will soon
resume its upward trend.
Top Market Contenders
The well-known market contenders in the global 3D IC are
mentioned as Tezzaron Semiconductor Corporation, and BeSang Inc., Xilinx Inc.,
United Microelectronics Corporation, Monolithic 3D Inc., Intel Corporation, 3M
Company, and, IBM Corporation.
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With the mounting demand for miniaturization of consumer
electronics and communication technology, a 3D IC is being considered as a
model solution as it enables the development of high performing microchips with
the low-power consumption capability and small form factor. Therefore,
transmission, high-speed data processing, enhanced storage capacity, smart and
connected devices, and high brightness lighting are some of the critical
requirements of modern electronic devices that are considering to be vital
motivating factors behind the growth of the 3D IC market.
On the same note, the development of high-performance
networking devices with large storage capacity needs enormous bandwidth. Thus,
to manage the bandwidth and memory challenges, companies are adopting 3D IC
technology owing to its chip density and high bandwidth benefits. This is yet
again an influential factor leading the market to earn more and more valuation
in the future. Additionally, the high proliferation of the Internet of Things
(IoT) devices and smart connected products, various manufacturers in the 3D IC
market are designing and manufacturing the ICs to employ various applications
such as Micro-Electro-Mechanical Systems (MEMS). The purpose stays to
streamline the processes, improve productivity, and reduce chances of sudden
failure and prevent downtime. The use of sensors in devices and machines are
influencing manufacturers in the 3D IC market to bring more new products, which
is also motivating the market to a great extent.
Segmentation of Market: 3D IC
From the viewpoint of segmental analysis, the global 3D IC
market is studied among various technology, components, products, and
applications.
Segmentation by Technology includes the type (3D stacked ICs
and monolithic 3D ICs) and packaging & integration (3D system-in-package
(Sip), 2.5D & 3D interposing, 3D wafer-level packaging (WLP), and 3D
heterogeneous integration.
Segmentation by Components included through glass vias (TGVs),
through-silicon vias (TSVs), and others.
Segmentation by Products has included 3D memory, CMOS image
sensors (CIS), MEMS & sensors, and light-emitting diodes.
Segmentation by Application has included consumer electronics,
IT/telecommunication, aerospace & defense, industrial, automotive, medical,
and others.
Regional Outlook
From the viewpoint of the region, the global commercial
telematics market study is conducted among crucial regions such as North
America, Europe, Asia Pacific, and the rest of the world.
Asia-Pacific is leading the global 3D IC market with the
largest market share owing to promising demand from the growing consumer
electronics market in the region. This is expected to expand with the highest
revenue by the year 2022.
Whereas, North America region will also expand as the
second-highest market after Asia-Pacific in the forecast period owing to the
rising demand for ICs in the U.S. and Canada region.
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