Industry Insight
Three-dimensional integrated circuits (ICs) are integrated
circuits with two or more circuitry layers in a single container. Both
vertically and horizontally, the layers are intertwined. Typically, multi-layer
chips are made by manufacturing stacking distinct layers and then thinning
them. 3D Integrated Circuit Market is
expected to grow at a CAGR of 17%. And may further reach up to USD 10,470
Million during the forecast period 2016-2022.
The 3D IC
Market Size will gain maximum prominence during these years. Although 3D ICs with TSVs do not require to
adopt new 3D design system, but they are having some technical challenges such
as development of cost-effective 3D processes and evaluation of various 3D
platforms for a given application or a system. Because of the complex
structure, fitting 3D ICs on a board is challenge for developers thereby
requires a capable PCB layout system with appropriate analysis tools.
Top Market Contenders
The well-known market contenders in the global 3D IC are
mentioned as Tezzaron Semiconductor Corporation, and BeSang Inc., Xilinx Inc.,
United Microelectronics Corporation, Monolithic 3D Inc., Intel Corporation, 3M
Company, and, IBM Corporation.
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Top Impacting Factors
The global market for commercial telematics is observing the
opportunity of expansion from a series of factors prevailing across the world
and affecting the shares accordingly. The foremost factor considered for the
market to expand is advancements in electronic products. The main objective of
designing 3D ICs is to achieve optimum electrical performance benefits. The
global 3d Ic Market has shown commendable growth for the last few decades and
is now likely to nurture at a decent pace in the next coming future.
With the mounting demand for miniaturization of consumer
electronics and communication technology, a 3D IC is being considered as a
model solution as it enables the development of high performing microchips with
the low-power consumption capability and small form factor. Therefore,
transmission, high-speed data processing, enhanced storage capacity, smart and
connected devices, and high brightness lighting are some of the critical
requirements of modern electronic devices that are considering to be vital
motivating factors behind the growth of the 3D IC market.
On the same note, the development of high-performance
networking devices with large storage capacity needs enormous bandwidth. Thus,
to manage the bandwidth and memory challenges, companies are adopting 3D IC
technology owing to its chip density and high bandwidth benefits. This is yet
again an influential factor leading the market to earn more and more valuation
in the future. Additionally, the high proliferation of the Internet of Things (IoT)
devices and smart connected products, various manufacturers in the 3D IC Market
Size are designing and manufacturing the ICs to employ various
applications such as Micro-Electro-Mechanical Systems (MEMS). The purpose stays
to streamline the processes, improve productivity, and reduce chances of sudden
failure and prevent downtime. The use of sensors in devices and machines are
influencing manufacturers in the 3D IC market to bring more new products, which
is also motivating the market to a great extent.
Segmentation of Market: 3D IC
From the viewpoint of segmental analysis, the global 3D IC
market is studied among various technology, components, products, and
applications.
Segmentation by Technology includes the type (3D stacked ICs
and monolithic 3D ICs) and packaging & integration (3D system-in-package
(Sip), 2.5D & 3D interposing, 3D wafer-level packaging (WLP), and 3D
heterogeneous integration.
Segmentation by Components included through glass vias (TGVs),
through-silicon vias (TSVs), and others.
Segmentation by Products has included 3D memory, CMOS image
sensors (CIS), MEMS & sensors, and light-emitting diodes.
Segmentation by Application has included consumer electronics,
IT/telecommunication, aerospace & defense, industrial, automotive, medical,
and others.
Regional Outlook
From the viewpoint of the region, the global commercial
telematics market study is conducted among crucial regions such as North
America, Europe, Asia Pacific, and the rest of the world.
Asia-Pacific is leading the global 3D IC market with the
largest market share owing to promising demand from the growing consumer
electronics market in the region. This is expected to expand with the highest
revenue by the year 2022.
Whereas, North America region will also expand as the second-highest
market after Asia-Pacific in the forecast period owing to the rising demand for
ICs in the U.S. and Canada region.
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