Market Scope
3D semiconductor packaging relies on traditional methods of
interconnectivity for exhibiting superior performance at reduced power. New
interconnect schemes such as copper-to-copper hybrid bonding for enabling 3D
integrated circuits can be beneficial to various manufacturers. The global 3D
Semiconductor Packaging Market report by Market Research Future (MRFR)
looks at various approaches for packing multiple ICs and other trends and
opportunities for the industry for the period of 2018 to 2023 (forecast period).
The COVID-19 pandemic and its implications on manufacturing are explored in the
report. The global 3D
Semiconductor Packaging Market is expected to witness a CAGR of 16.25%
during the forecast period for surpassing a valuation of USD 37,400 million by
2023.
Competitive Outlook
Xilinx Inc., ams AG, STMicroelectronics NV, Taiwan
Semiconductor Manufacturing Co. Ltd., Siliconware Precision Industries Co.,
Ltd., Intel Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd.,
Advanced Semiconductor Engineering Inc., Samsung Electronics Corporation Ltd.,
and Amkor Tecnhology Inc. are the key players.
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Segmentation
By type, it is segmented into 3D WLP, 3D SIC, 3D SIP, and 3D
IC. In 2017, the 3D SIP segment commanded 33.5% market share. During the
forecast period, the segment is expected to surge at a robust CAGR of 15.0%. 3D
SIP is primarily used in premium-grade products.
By packaging method, it is segmented into package on package,
through class via (TGV), through silicon via (TSV), and others. In 2017, the
through silicon via (TSV) segment stood at a market valuation of USD 6,372.0
million. In terms of revenue, the segment has made a significant contribution
to the global 3D semiconductor packaging market. TSV contains high density and
short connection hence it is preferred over package-on-package.
By end use, it is segmented into industrial, automotive,
military and aerospace, consumer electronics, telecommunication, and others.
The consumer electronics segment holds the largest share of the market in terms
of value. In addition, the segment is expected to witness a CAGR of 15.99%
during the review period and reach a valuation is excess of USD 11,700 million
by 2023. This is primarily owing to robust growth of the consumer electronics
sector in recent years.
Regional Analysis
On a regional level, Asia Pacific, led by China is expected to
remain a highly attractive market for 3D semiconductor packaging during the
review period. In 2018, Asia-Pacific accounted for the largest market share in
term of revenue and the trend is likely to continue over the next several
years. Asia-Pacific 3D semiconductor packaging market is projected to increase
at 18.9% CAGR during the forecast period. The market in the region is currently
valued at more than USD 8,000 million. A strong presence of market players in
the region has led to the faster development of 3D semiconductor packaging
technologies and widespread availability semiconductor products. Furthermore,
state-backed initiatives and investments are creating an environment where such
cutting-edge technologies can thrive. This also supports a strong R&D
pipeline for the semiconductor industry.
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The market in North America held the second position in 2017
with a valuation of USD 3,888.2 million. During the forecast period, North
America 3D Semiconductor Packaging Market is projected to exhibit a CAGR
of 14.6%. Market’s growth in the region is driven the strong growth of
electronics industry in countries such the US, Canada and Mexico. American
consumers are leaning towards miniaturized electronic devices that are compact
but do not compromise on power. In addition, rapid adoption of high-end
electronic devices and rise of machine learning and artificial intelligence
(AI) are other factors that are likely promote the application of 3D packaging
for various semiconductor components.
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