Market Scope
As per the latest report published by Market Research Future
(MRFR), the global Power Supply In Package (Psip) And Power Supply On Chip (Pwrsoc)
Market is set to reach a valuation of USD 2,300 Million between
2017- 2023.
Power electronics are witnessing widespread adoption across
various industry verticals. The incessant technological innovation has led to
the need for greater power efficiency, high density, and design flexibility of
power modules. PSiP and PwrSoC are hardware components that work as an
intermediary to supply power in electrical device via a package or a chip.
They facilitate a smooth flow of power over the printed circuit board (PCB).
The low output voltage of these processors while following the
trend of miniaturization can culminate in a huge market demand. The integration
of off-the-shelf converters which lower development and design costs can
bolster the market demand. However, thermal challenges can impede the market
growth.
The impending need for energy conservation has expedited the
need for microprocessors which can handle large power loads. Power supply in
package chip (PSiP) and power supply on chip (PwrSoC) are recent power
conversion technologies which can pave the path for future power management
platforms. The global
Power Supply in Package and Power Supply on
Chip Market report by
Market Research Future (MRFR) considers the various drivers and hurdles for the
industry for the period of 2017 to 2023 (forecast period). The sudden outbreak
of the COVID-19 virus and its impact are analyzed in the report.
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Sample of Report @ https://www.marketresearchfuture.com/sample_request/7764
Competitive Outlook
Amkor Technology, Texas Instruments Incorporated, Bel Fuse
Inc., Panasonic Corporation, ON Semiconductor, TDK Corporation, Intel
Corporation, Vicor Corporation, ASE Group, and Jiangsu Changjiang Electronics
Technology Co. Ltd. are key players of the global PSiP and PWoC market.
Segmentation
In 2017, the PSiP segment commanded for more than 89% share of
the market in terms of value. It is anticipated to reach a valuation in access
of USD 2,000 Mn exhibiting a healthy growth rate till the end of the forecast period.
PSiP is used in automotive systems, portable devices, telecom devices, servers,
routers, set-top boxes, laptops, desktop systems, and medical devices.
The consumer electronics segment currently accounts for the
lion’s share of the market. The application is expected to reach a
valuation of USD 1,354.4 Mn by 2023. The consumer electronics segment has been
witnessing a robust growth in recent years, consequently driving the demand for
PSiPs and PwrSoC.
Regional Analysis
Regions that were covered in the report include Europe, North
America, Asia Pacific (APAC), the Middle East & Africa (MEA), and South
America. The market in APAC is expected to remain highly attractive during the
forecast period. In 2017, APAC commanded 48.3% share of the market and projected
to exhibit 26.9% CAGR during the assessment period. The manufacturing sector in
the region has undergone massive transformation in recent years, which is
having a positive impact on the market in the region. China’s rise as a global
manufacturing hub has drawn significant investment in the countries.
North America and Europe are the two other important markets
for PSiP and PwrSoC. During the review period, the market in North America is
projected to post a relatively higher CAGR, meanwhile Europe will retain its
position as the third largest power supply in package (PSiP) and power supply
on chip (PwrSoC) market.
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complete Report @ https://www.marketresearchfuture.com/reports/power-supply-in-package-chip-market-7764
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